One-Chip Smart SBC for Edge Nodes: IM908xC/L

MCU, LDO, and CAN/LIN PHY triple integration; ASIL-B functional safety; lower cost, higher efficiency.

The IM908xC/L series Smart SBC is Immorta's automotive-grade three-in-one integrated chip designed for automotive edge intelligent nodes. It integrates a 40V high-voltage LDO, CAN/LIN transceivers, and an embedded MCU, delivering enhanced safety, rich connectivity, and good scalability. The product has passed AEC-Q100 Grade 1 testing and complies with the ISO 26262 ASIL-B functional-safety standard, widely used in various automotive actuators and sensing controllers such as sentinel sensors, gas sensors, fragrance generators, light controllers, seats, doors/windows, wiper controllers, as well as BLDC/PMSM motor control and in-vehicle switches.

Main Features

• AEC-Q100 Grade 1, operating temperature -40℃ to 125℃
• ISO 26262 ASIL-B functional-safety compliant
• 32-bit Arm® Cortex®-M0+ core, 48 MHz
• One high-voltage LDO, 6V~40V
• One CAN PHY compliant with ISO 11898-2:2016, CAN FD up to 5 Mbit/s
• One LIN PHY compatible with LIN 2.0/2.1/2.2, up to 20 Kbps
• 256 KB Flash, 64 KB Data Flash (100k erase/write cycles), 32 KB SRAM, all with ECC

Highlights

• High integration: one chip replaces many, simplifying design and reducing BOM and PCB area.
• High reliability: fewer external components and solder joints enhance system stability.
• Excellent EMC: built-in CAN/LIN physical layer meets EMC requirements for stable communication.
• Functional safety: ASIL-B compliant for safe, reliable applications.
• Efficient power: 6V–40V range optimizes energy and reduces external regulators.
• Large Flash: 256 KB Code Flash for code; 64 KB Data Flash for mass storage and emulated EEPROM, improving flexibility.

Applications

Specifications

• Compliant with AEC-Q100 Grade 1

• Integrated high-voltage LDO, input voltage: 6 V ~ 40 V
• Ambient temperature: -40 ℃ ~ +125 ℃

• Integrated high-voltage LDO
• Built-in integrated CAN PHY transceiver
• Built-in integrated LIN PHY transceiver

• 32-bit Arm® Cortex®-M0+ core
• Configurable Nested Vectored Interrupt Controller (NVIC)
• CPU frequency 48 MHz
• 8 programmable memory-region MPU
• SysTick

• Integrated PMC supports STOP and RUN modes
• GPIO edge-wakeup support
• STOP-mode current ≤ 40 µA at 25 ℃

• External high-speed clock (XOSC): 4 MHz ~ 30 MHz
• Internal high-speed clock (HFOSC): 8 MHz
• Internal low-speed clock (LPOSC): 32 kHz
• Phase-Locked Loop (PLL)

• PFlash up to 256 KB, DFlash up to 64 KB, with ECC
• Software-emulated EEPROM for data storage
• RAM up to 32 KB, with ECC

• LQFP48, QFN80

• Designed to the ISO 26262 ASIL-B level
• Unique chip identifier (UUID)
• Clock monitor
• Low-voltage detection and low-voltage reset (LVD/LVR)
• Independent-clock watchdog (WDG)

• Cyclic Redundancy Check module (CRC)
• Serial Wire Debug interface (SWD)
• 4-channel DMA
• HAU (Hardware Acceleration Unit) accelerates complex operations (division / square root / RMS / trigonometric functions, etc.)

• Up to 3 UART modules with DMA; all support software LIN
• Up to 2 I2C modules with DMA
• Up to 2 SPI modules with DMA
• 1 CAN-FD module, compatible with CAN 2.0B

• 1× 20-channel 12-bit 1 Msps SAR ADC
• 1× 8-channel CMP (analog comparator)
• 1× 8-bit DAC for comparator and external output
• Built-in temperature sensor

• 2× 8-channel SPWM modules, 2× 4-channel IPWM modules
• 2× 32-bit timers
• 1× 32-bit RTC

• Up to 57 GPIO pins with edge-interrupt support
• Non-Maskable Interrupt (NMI) support

Cost Down & Efficiency

The trend toward ECU integration is a key driver in optimizing modern automotive electronic systems. As vehicle functionality and intelligence grow, traditional distributed ECU architectures reveal problems of complex design, large space occupation, and inter-system communication latency. By integrating typical node building blocks (such as an MCU with standard peripherals, voltage regulator, and communication interfaces) into a single chip, BOM cost and space requirements are significantly reduced while system reliability improves and architecture simplifies. The IM908xC/L series is a prime example of this trend.

The IM908xC/L provides a simpler, more reliable, and more economical solution for modern automotive systems, effectively reducing cost and improving efficiency for customer systems. For example, in an anti-pinch window system, compared with the traditional three-chip discrete solution (voltage regulator + LIN PHY + embedded MCU), using a single IM90xxL chip offers the following advantages:

• Reduced BOM (fewer chips and passive components)
• Smaller PCB
• Less design space required (easier to meet OEM spatial constraints)
• More reliable design (integration yields higher system reliability)

Its cost and efficiency gains also show in:

• Manufacturing cost (fewer components to mount, less testing than multiple chips)
• Improved quality (fewer solder joints and tested subsystems)
• Simplified supply chain (fewer chip types, less procurement, ordering, inventory, and tracking)
• Faster time-to-market (pre-designed subsystems and software accelerate development)

Product Naming

Product Series

Package Type

T: Trays packaging

IM90: developed on Arm M0+ core

Package Form

Flash Capacity

8: PFlash up to 256 KB

Q: QFN package

L: LQFP package

Pin Count

AEC-Q100 Grade

E: 48 pins

H: 80 pins

B: Compliant with AEC-Q100 Grade 1

Product Function

CPU Frequency

C: Integrated LDO and CAN PHY

L: Integrated LDO and LIN PHY

L: CPU 48 MHz

Product Models

IM90

8

E

C

L

B

L

T