IM1169

Secure SBC Supporting CAN Ringing Suppression

Supports Selective Wake-up Function to Build Ultra-Low Power Electrical Systems


The Immorta IM1169 is a domestic automotive-grade SBC chip that integrates a CAN transceiver with Partial Networking (PN) management capabilities and Signal Improvement Capability (SIC). The CAN transceiver complies with the "ISO 11898-2:2024" physical layer compliance standard. Its CAN FD SIC feature supports data transmission rates up to 8 Mbps and provides seamless interoperability and excellent compatibility with various CAN bus devices, enabling efficient and stable data transmission in complex in-vehicle networks. 

IM1169 is equipped with comprehensive fault monitoring and diagnostic functions, along with an integrated independent watchdog circuit, supporting ASIL-B functional safety product development. It is widely applicable to various automotive electronic scenarios. In addition, IM1169 provides excellent EMC performance, with its CAN pins reaching HBM ±8kV and achieving Class A in BCI Level IV (200mA) testing, satisfying the stringent electromagnetic compatibility requirements of modern vehicles. 

• Compliant with AEC-Q100 automotive qualification 

• Operating junction temperature: -40°C to +150°C 

• Complies with ISO 11898-2:2016 and CiA 601-4 Electrical Physical Layer (EPL) specifications 

• Supports CAN FD SIC ringing suppression function, supporting communication rates up to 8 Mbps 

• Supports window and timeout mode watchdogs with redundant misconfiguration safety protection 

• Supports low-power modes, featuring WAKE pin wake-up and CAN wake-up; wake-up sources can be identified via SPI 

• Supports one selectable LDO1 3.3V/5V output, delivering up to 300mA current with ±2% accuracy 

• Supports one LDO 5V output at 100mA, usable for CAN or external sensor power supply 

• Supports SPI diagnostics for safety functions, detecting anomalies such as LDO overvoltage, undervoltage, overtemperature, short circuit, and overcurrent 

• Supports Normal mode, low-power Standby mode, and low-power Sleep mode 

• Supports LIMP (limp-home) mode output, with output logic customizable via MTP NVM configuration 

• Supports RSTN bidirectional reset pin, with output pulse width customizable via MTP NVM 

• Supports more than 500 MTP NVM programming cycles 

Product Highlights & Core Competencies

• 8 Mbit/s CAN SIC: Ringing suppression for high-speed networks. 

• Selective Wake-up: PN capabilities for ultra-low power consumption. 

• Safety Diagnostics: Advanced safety monitoring and protection via SPI configuration. 

• Dual Power Support: Independent 3.3V/5V LDO rails. 

• High Customizability: 500+ times MTP NVM programming for custom behaviors. 

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Highlights

image.png8Mbit/s CAN SIC


image.pngSelective Wake-up, Low Power Consumption


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Safety Diagnostics & Protection, SPI Configuratio



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3.3V/5V Power Supply Support



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Customizable Configuration, 500-cycle MTP NVM



Applications

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Product Ordering Matrix

ModuleIM1169/X/F/SIM1169A/3/F/SIM1169A/XIM1169A/X/FIM1169A/3IM1169A/3/F

CAN FD

CAN SIC





CAN PN



LDO1

5V 300mA

3.3V 300mA

5V 300mA

5V 300mA

3.3V 300mA

3.3V 300mA

LDO_Senor

5V 100mA


5V 100mA

5V 100mA



LDO_CAN


5V 100mA



5V 100mA

5V 100mA

SPI

Watchdog

MTPNV

Package

DFN20

DFN20

DFN20

DFN20

DFN20

DFN20


Pin Configuration

IM1169.png

Pin Number

Pin Name

Pin Type

Function Description

1

GND

Ground

Ground

2

TXD

Input

Digital logic input for the transmitter

3

SDI

Input

SPI digital logic input

4

GND

Ground

Ground

5

V1

LDO Output

V1 voltage regulator output

6

NC

N/A

No Connection

7

RXD

Output

Digital logic output for the receiver

8

RSTN

I/O

Controls the reset of the external system and puts the internal system into reset mode

9

SDO

Output

SPI digital logic output

10

SCK

Input

SPI digital clock input

11

LIMP

Output

Limp home mode output

12

WAKE

Input

Local wake-up input

13

V2

Output

V2 voltage regulator output

13

VEXT

Output

VEXT external sensor power supply output (only for variants with ‘X’ in the part number)

14

VBAT

Power Input

Battery power supply

15

NC

N/A

No Connection

16

GND

Ground

Ground

17

CANL

I/O

CAN bus low-level line

18

CANH

I/O

CAN bus high-level line

19

GND

Ground

Ground

20

SCSN

Input

SPI digital chip select input


Thermal Pad

Ground

Thermal pad. It must be connected to ground (GND) during use to enhance heat dissipation performance.


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